CVE-2025-27071— Buffer Copy Without Checking Size of Input in Powerline Communication Firmware
Get alerts for future matching vulnerabilitiesLog in to subscribe
I. Basic Information for CVE-2025-27071
Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗ Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.
Vulnerability Title
Buffer Copy Without Checking Size of Input in Powerline Communication Firmware
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption while processing specific files in Powerline Communication Firmware.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Source: NVD (National Vulnerability Database)
Vulnerability Type
未进行输入大小检查的缓冲区拷贝(传统缓冲区溢出)
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于处理特定文件时可能导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6800 | - |
II. Public POCs for CVE-2025-27071
| # | POC Description | Source Link | Shenlong Link |
|---|
AI-Generated POCPremium
No public POC found.
Login to generate AI POCIII. Intelligence Information for CVE-2025-27071
请登录查看更多情报信息。
Same Patch Batch · Qualcomm, Inc. · 2025-08-06 · 24 CVEs total
| CVE-2025-27076 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in Display |
| CVE-2025-27075 | 7.8 HIGH | Improper Validation of Array Index in Bluetooth HOST |
| CVE-2025-21455 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux |
| CVE-2025-27069 | 7.8 HIGH | Untrusted Pointer Dereference in DSP Service |
| CVE-2025-27068 | 7.8 HIGH | Buffer Over-read in Camera |
| CVE-2025-27067 | 7.8 HIGH | Improper Validation of Array Index in DSP Service |
| CVE-2025-21456 | 7.8 HIGH | Use After Free in NPU |
| CVE-2025-21458 | 7.8 HIGH | Use After Free in NPU |
| CVE-2025-27062 | 7.8 HIGH | Improper Access Control in Automotive Multimedia |
| CVE-2025-21461 | 7.8 HIGH | Out-of-bounds Write in Camera_Linux |
| CVE-2025-21474 | 7.8 HIGH | Use After Free in BTHOST |
| CVE-2025-21473 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux |
| CVE-2025-21452 | 7.5 HIGH | Reachable Assertion in Modem |
| CVE-2025-47324 | 7.5 HIGH | Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware |
| CVE-2025-21477 | 7.5 HIGH | Improper Input Validation in Modem |
| CVE-2025-27065 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2025-27066 | 7.5 HIGH | Reachable Assertion in WLAN Firmware |
| CVE-2025-27073 | 7.5 HIGH | Reachable Assertion in WLAN Firmware |
| CVE-2025-21465 | 6.5 MEDIUM | Out-of-bounds Read in Core |
| CVE-2025-21464 | 6.5 MEDIUM | Out-of-bounds Read in Core |
Showing top 20 of 24 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-120
- CVE-2026-8260
D-Link DCS-935L HNAP Service hnap_service SetDeviceSettings - CVE-2026-8137
Totolink X5000R formDdns sub_458E40 buffer overflow - CVE-2026-6691
MongoDB C Driver Cyrus SASL Canonicalization Buffer Overflow - CVE-2026-7857
D-Link DI-8100 CGI user_group.asp sprintf buffer overflow - CVE-2026-7856
D-Link DI-8100 Web Management url_member.asp buffer overflow
V. Comments for CVE-2025-27071
No comments yet