CVE-2025-27069— Untrusted Pointer Dereference in DSP Service
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I. Basic Information for CVE-2025-27069
Vulnerability Information
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Vulnerability Title
Untrusted Pointer Dereference in DSP Service
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption while processing DDI command calls.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
非可信指针解引用
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于处理DDI命令调用时可能导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6900 | - |
II. Public POCs for CVE-2025-27069
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2025-08-06 · 24 CVEs total
| CVE-2025-27076 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in Display |
| CVE-2025-27075 | 7.8 HIGH | Improper Validation of Array Index in Bluetooth HOST |
| CVE-2025-21455 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux |
| CVE-2025-21456 | 7.8 HIGH | Use After Free in NPU |
| CVE-2025-27068 | 7.8 HIGH | Buffer Over-read in Camera |
| CVE-2025-27067 | 7.8 HIGH | Improper Validation of Array Index in DSP Service |
| CVE-2025-21458 | 7.8 HIGH | Use After Free in NPU |
| CVE-2025-21461 | 7.8 HIGH | Out-of-bounds Write in Camera_Linux |
| CVE-2025-27062 | 7.8 HIGH | Improper Access Control in Automotive Multimedia |
| CVE-2025-21473 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera_Linux |
| CVE-2025-21474 | 7.8 HIGH | Use After Free in BTHOST |
| CVE-2025-21452 | 7.5 HIGH | Reachable Assertion in Modem |
| CVE-2025-47324 | 7.5 HIGH | Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware |
| CVE-2025-21477 | 7.5 HIGH | Improper Input Validation in Modem |
| CVE-2025-27065 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2025-27066 | 7.5 HIGH | Reachable Assertion in WLAN Firmware |
| CVE-2025-27073 | 7.5 HIGH | Reachable Assertion in WLAN Firmware |
| CVE-2025-27071 | 7.3 HIGH | Buffer Copy Without Checking Size of Input in Powerline Communication Firmware |
| CVE-2025-21465 | 6.5 MEDIUM | Out-of-bounds Read in Core |
| CVE-2025-21464 | 6.5 MEDIUM | Out-of-bounds Read in Core |
Showing top 20 of 24 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-822
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V. Comments for CVE-2025-27069
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