CVE-2023-28576— Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver
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I. Basic Information for CVE-2023-28576
Vulnerability Information
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Vulnerability Title
Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver
Source: NVD (National Vulnerability Database)
Vulnerability Description
The buffer obtained from kernel APIs such as cam_mem_get_cpu_buf() may be readable/writable in userspace after kernel accesses it. In other words, user mode may race and modify the packet header (e.g. header.count), causing checks (e.g. size checks) in kernel code to be invalid. This may lead to out-of-bounds read/write issues.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:H/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
检查时间与使用时间(TOCTOU)的竞争条件
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm 芯片存在安全漏洞，该漏洞源于从 cam_mem_get_cpu_buf() 等内核 API 获取的缓冲区在内核访问后可能在用户空间中可读/可写。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6800 | - |
II. Public POCs for CVE-2023-28576
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-08-08 · 18 CVEs total
| CVE-2022-40510 | 9.8 CRITICAL | Buffer copy without checking size of input in Audio. |
| CVE-2023-28561 | 9.8 CRITICAL | Buffer Copy Without Checking Size of Input in QESL |
| CVE-2023-21651 | 9.3 CRITICAL | Incorrect Type Conversion or Cast in Core |
| CVE-2023-21643 | 9.1 CRITICAL | Untrusted Pointer Dereference in Automotive |
| CVE-2023-28537 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-22666 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-21625 | 8.2 HIGH | Buffer Over-read in Network Services |
| CVE-2023-21652 | 7.7 HIGH | Key Management Errors in HLOS |
| CVE-2023-28555 | 7.5 HIGH | Buffer Over-read in Audio |
| CVE-2023-21626 | 7.1 HIGH | Improper Authentication in HLOS. |
| CVE-2023-21650 | 6.7 MEDIUM | Improper Validation of Array Index in GPS HLOS Driver |
| CVE-2023-21627 | 6.7 MEDIUM | Incorrect Type Conversion or Cast in Trusted Execution Environment |
| CVE-2023-21648 | 6.7 MEDIUM | Integer Overflow to Buffer Overflow in RIL |
| CVE-2023-21649 | 6.7 MEDIUM | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN |
| CVE-2023-28577 | 6.7 MEDIUM | Multiple Dmabuf Kernel Address UAF Vulnerability |
| CVE-2023-28575 | 6.7 MEDIUM | Multiple Type Confusion Vulnerability |
| CVE-2023-21647 | 6.5 MEDIUM | Improper Input Validation in Bluetooth HOST |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-367
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V. Comments for CVE-2023-28576
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