CVE-2023-21643— Untrusted Pointer Dereference in Automotive
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I. Basic Information for CVE-2023-21643
Vulnerability Information
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Vulnerability Title
Untrusted Pointer Dereference in Automotive
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption due to untrusted pointer dereference in automotive during system call.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:L/UI:N/S:C/C:L/I:H/A:L
Source: NVD (National Vulnerability Database)
Vulnerability Type
非可信指针解引用
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于系统调用期间汽车中不受信任的指针取消引用导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | APQ8064AU | - |
II. Public POCs for CVE-2023-21643
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-08-08 · 18 CVEs total
| CVE-2022-40510 | 9.8 CRITICAL | Buffer copy without checking size of input in Audio. |
| CVE-2023-28561 | 9.8 CRITICAL | Buffer Copy Without Checking Size of Input in QESL |
| CVE-2023-21651 | 9.3 CRITICAL | Incorrect Type Conversion or Cast in Core |
| CVE-2023-28537 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-22666 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-21625 | 8.2 HIGH | Buffer Over-read in Network Services |
| CVE-2023-21652 | 7.7 HIGH | Key Management Errors in HLOS |
| CVE-2023-28555 | 7.5 HIGH | Buffer Over-read in Audio |
| CVE-2023-21626 | 7.1 HIGH | Improper Authentication in HLOS. |
| CVE-2023-28575 | 6.7 MEDIUM | Multiple Type Confusion Vulnerability |
| CVE-2023-28577 | 6.7 MEDIUM | Multiple Dmabuf Kernel Address UAF Vulnerability |
| CVE-2023-21650 | 6.7 MEDIUM | Improper Validation of Array Index in GPS HLOS Driver |
| CVE-2023-21649 | 6.7 MEDIUM | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN |
| CVE-2023-21648 | 6.7 MEDIUM | Integer Overflow to Buffer Overflow in RIL |
| CVE-2023-21627 | 6.7 MEDIUM | Incorrect Type Conversion or Cast in Trusted Execution Environment |
| CVE-2023-21647 | 6.5 MEDIUM | Improper Input Validation in Bluetooth HOST |
| CVE-2023-28576 | 6.4 MEDIUM | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-822
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V. Comments for CVE-2023-21643
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