CVE-2023-21651— Incorrect Type Conversion or Cast in Core
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I. Basic Information for CVE-2023-21651
Vulnerability Information
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Vulnerability Title
Incorrect Type Conversion or Cast in Core
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
不正确的类型转换
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于 TEE 中的 secure_io_read/write 函数中的类型转换或转换不正确，导致核心内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | AQT1000 | - |
II. Public POCs for CVE-2023-21651
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-08-08 · 18 CVEs total
| CVE-2022-40510 | 9.8 CRITICAL | Buffer copy without checking size of input in Audio. |
| CVE-2023-28561 | 9.8 CRITICAL | Buffer Copy Without Checking Size of Input in QESL |
| CVE-2023-21643 | 9.1 CRITICAL | Untrusted Pointer Dereference in Automotive |
| CVE-2023-28537 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-22666 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-21625 | 8.2 HIGH | Buffer Over-read in Network Services |
| CVE-2023-21652 | 7.7 HIGH | Key Management Errors in HLOS |
| CVE-2023-28555 | 7.5 HIGH | Buffer Over-read in Audio |
| CVE-2023-21626 | 7.1 HIGH | Improper Authentication in HLOS. |
| CVE-2023-21650 | 6.7 MEDIUM | Improper Validation of Array Index in GPS HLOS Driver |
| CVE-2023-21627 | 6.7 MEDIUM | Incorrect Type Conversion or Cast in Trusted Execution Environment |
| CVE-2023-21648 | 6.7 MEDIUM | Integer Overflow to Buffer Overflow in RIL |
| CVE-2023-21649 | 6.7 MEDIUM | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN |
| CVE-2023-28577 | 6.7 MEDIUM | Multiple Dmabuf Kernel Address UAF Vulnerability |
| CVE-2023-28575 | 6.7 MEDIUM | Multiple Type Confusion Vulnerability |
| CVE-2023-21647 | 6.5 MEDIUM | Improper Input Validation in Bluetooth HOST |
| CVE-2023-28576 | 6.4 MEDIUM | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-704
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V. Comments for CVE-2023-21651
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