CVE-2023-21666— Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics
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I. Basic Information for CVE-2023-21666
Vulnerability Information
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Vulnerability Title
Improper Release of Memory Before Removing Last Reference (`Memory Leak`) in Graphics
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
在移除最后引用时对内存的释放不恰当(内存泄露)
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 部分Qualcomm产品存在安全漏洞，该漏洞源于内存释放不当，导致内存损坏。以下产品受到影响：315 5G IoT Modem, 9206 LTE Modem, APQ8017, AQT1000, AR8031, AR8035, C-V2X 9150, CSRA6620, CSRA6640, CSRB31024, FastConnect 6200,
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | 315 5G IoT Modem | - |
II. Public POCs for CVE-2023-21666
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-05-02 · 13 CVEs total
| CVE-2023-21665 | 8.4 HIGH | Incorrect Type Conversion or Cast in Graphics |
| CVE-2023-21642 | 8.4 HIGH | Improper Access Control in HAB Memory Management |
| CVE-2022-40505 | 8.2 HIGH | Buffer over-read in Modem |
| CVE-2022-33292 | 7.8 HIGH | Use after free in Qualcomm IPC |
| CVE-2022-25713 | 7.8 HIGH | Improper Restriction of Operations within the Bounds of a Memory Buffer in Automotive |
| CVE-2022-40504 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-40508 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-34144 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-33305 | 7.5 HIGH | Null pointer dereference in Modem |
| CVE-2022-33304 | 7.5 HIGH | NULL pointers dereference in Modem |
| CVE-2022-33273 | 7.3 HIGH | Buffer over-read in Trusted Execution Environment |
| CVE-2022-33281 | 6.7 MEDIUM | Improper validation of array index in computer vision. |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-401
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Junos OS: MX Series: Mismatch between configured and receive - CVE-2026-33782
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V. Comments for CVE-2023-21666
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