CVE-2018-11264
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I. Basic Information for CVE-2018-11264
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的Ontario指纹代码存在缓冲区溢出漏洞，该漏洞源于程序没有对参数执行输入检测。攻击者可利用该漏洞执行未授权的操作。以下产品（用于汽车、移动和可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MSM8996AU；SD 210；SD 212；SD 205；SD 410/12；SD 425；SD 430；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660 | - |
II. Public POCs for CVE-2018-11264
| # | POC Description | Source Link | Shenlong Link |
|---|
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- https://www.qualcomm.com/company/product-security/bulletinsx_refsource_CONFIRM
- https://nvd.nist.gov/vuln/detail/CVE-2018-11264
Same Patch Batch · Qualcomm, Inc. · 2018-11-28 · 14 CVEs total
| CVE-2017-18315 | Qualcomm SD 600 缓冲区错误漏洞 | |
| CVE-2017-18316 | 多款Qualcomm Snapdragon产品访问控制错误漏洞 | |
| CVE-2017-18317 | 多款Qualcomm Snapdragon产品输入验证漏洞 | |
| CVE-2017-18318 | 多款Qualcomm Snapdragon产品输入验证漏洞 | |
| CVE-2018-11921 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-11994 | 多款Qualcomm Snapdragon产品访问控制错误漏洞 | |
| CVE-2018-11996 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-5870 | Qualcomm Snapdragon Mobile SD 835、SDA660和SDX24 安全漏洞 | |
| CVE-2018-5877 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-5912 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2018-5916 | 多款Qualcomm Snapdragon产品信息泄露漏洞 | |
| CVE-2018-5917 | 多款Qualcomm Snapdragon产品缓冲区错误漏洞 | |
| CVE-2018-5918 | 多款Qualcomm Snapdragon产品缓冲区错误漏洞 |
IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11264
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