CVE-2024-23360— Improper Access Control in Graphics Windows
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I. Basic Information for CVE-2024-23360
Vulnerability Information
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Vulnerability Title
Improper Access Control in Graphics Windows
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption while creating a LPAC client as LPAC engine was allowed to access GPU registers.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
访问控制不恰当
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于创建 LPAC 客户端时发生内存损坏，因为 LPAC 引擎被允许访问 GPU 寄存器。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6700 | - |
II. Public POCs for CVE-2024-23360
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2024-06-03 · 12 CVEs total
| CVE-2023-43538 | 9.3 CRITICAL | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in TZ Secure OS |
| CVE-2023-43556 | 9.3 CRITICAL | Buffer Copy Without Checking Size of Input in Hypervisor |
| CVE-2023-43551 | 9.1 CRITICAL | Improper Authentication in Multi-Mode Call Processor |
| CVE-2023-43555 | 8.2 HIGH | Buffer Over-read in Video |
| CVE-2023-43542 | 7.8 HIGH | Buffer Copy Without Checking Size of Input in Trusted Execution Environment |
| CVE-2024-23363 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2023-43543 | 6.7 MEDIUM | Use After Free in Audio |
| CVE-2023-43544 | 6.7 MEDIUM | Use After Free in Audio |
| CVE-2023-43545 | 6.7 MEDIUM | Integer Overflow or Wraparound in WLAN HOST |
| CVE-2023-43537 | 6.5 MEDIUM | Buffer Over-read in WLAN Host |
| CVE-2024-21478 | 6.2 MEDIUM | NULL Pointer Dereference in Graphics |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-284
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V. Comments for CVE-2024-23360
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