CVE-2022-22071
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I. Basic Information for CVE-2022-22071
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm多款产品 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Snapdragon SOC（骁龙处理器）是美国高通（Qualcomm）公司的一款应用于移动设备处理信息的芯片。 Qualcomm多款产品存在安全漏洞，该漏洞源于在使用IOCTL munmap调用释放进程外壳内存并进行进程初始化时出现释放后重用情况。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Shenlong Deep Dive — AI Deep Analysis
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Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | APQ8053, AR8031, AR8035, CSRA6620, CSRA6640, MDM9150, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS405, QCS410, QCS4290, QCS610, | - |
II. Public POCs for CVE-2022-22071
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2022-06-14 · 68 CVEs total
| CVE-2022-25651 | 9.8 CRITICAL | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2021-35081 | 9.8 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2021-30341 | 9.8 CRITICAL | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2021-35104 | 9.8 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2021-35090 | 9.3 CRITICAL | Qualcomm 安全漏洞 |
| CVE-2021-30342 | 9.1 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2021-30347 | 9.1 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2021-30343 | 9.1 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2021-35082 | 9.1 CRITICAL | Qualcomm多款产品 安全漏洞 |
| CVE-2021-30339 | 9.0 CRITICAL | 多款Qualcomm芯片安全漏洞 |
| CVE-2021-35123 | 8.8 HIGH | 多款Qualcomm产品安全漏洞 |
| CVE-2021-30334 | 8.4 HIGH | 多款Qualcomm产品资源管理错误漏洞 |
| CVE-2021-30350 | 8.4 HIGH | 多款Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30281 | 8.4 HIGH | 多款Qualcomm产品访问控制错误漏洞 |
| CVE-2022-22068 | 8.4 HIGH | 多款Qualcomm产品资源管理错误漏洞 |
| CVE-2022-22090 | 8.4 HIGH | 多款Qualcomm产品资源管理错误漏洞 |
| CVE-2021-35126 | 8.4 HIGH | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-35112 | 8.4 HIGH | 多款Qualcomm产品访问控制错误漏洞 |
| CVE-2021-35114 | 8.4 HIGH | Qualcomm 缓冲区错误漏洞 |
| CVE-2021-35095 | 8.4 HIGH | Qualcomm 芯片 代码问题漏洞 |
Showing top 20 of 68 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-22071
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