Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1000 CNY

100.0%
Buy Us a Coffee

CVE-2022-22090

CVSS 8.4 · High EPSS 0.04% · P13
Get alerts for future matching vulnerabilitiesLog in to subscribe

I. Basic Information for CVE-2022-22090

Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在资源管理错误漏洞，该漏洞源于在音频中管理来自内部缓存的缓冲区时出现释放后重用错误。本地攻击者利用该漏洞在目标系统上执行任意代码。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile SD 8 Gen1 5G, SD865 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835 -

II. Public POCs for CVE-2022-22090

#POC DescriptionSource LinkShenlong Link
AI-Generated POCPremium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2022-22090

请登录查看更多情报信息。

Same Patch Batch · Qualcomm, Inc. · 2022-06-14 · 68 CVEs total

CVE-2022-256519.8 CRITICALQualcomm 芯片输入验证错误漏洞
CVE-2021-350819.8 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303419.8 CRITICAL多款Qualcomm产品缓冲区错误漏洞
CVE-2021-351049.8 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-350909.3 CRITICALQualcomm 安全漏洞
CVE-2021-350829.1 CRITICALQualcomm多款产品 安全漏洞
CVE-2021-303429.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303439.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303479.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303399.0 CRITICAL多款Qualcomm芯片安全漏洞
CVE-2021-351238.8 HIGH多款Qualcomm产品安全漏洞
CVE-2021-302818.4 HIGH多款Qualcomm产品访问控制错误漏洞
CVE-2021-303348.4 HIGH多款Qualcomm产品资源管理错误漏洞
CVE-2022-220718.4 HIGHQualcomm多款产品 资源管理错误漏洞
CVE-2022-220688.4 HIGH多款Qualcomm产品资源管理错误漏洞
CVE-2021-303508.4 HIGH多款Qualcomm 芯片缓冲区错误漏洞
CVE-2021-351268.4 HIGH多款Qualcomm产品输入验证错误漏洞
CVE-2021-351128.4 HIGH多款Qualcomm产品访问控制错误漏洞
CVE-2021-351148.4 HIGHQualcomm 缓冲区错误漏洞
CVE-2021-350958.4 HIGHQualcomm 芯片 代码问题漏洞

Showing top 20 of 68 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2022-22090

No comments yet

Leave a comment