CVE-2022-40507— Double free in Core
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I. Basic Information for CVE-2022-40507
Vulnerability Information
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Vulnerability Title
Double free in Core
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption due to double free in Core while mapping HLOS address to the list.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
双重释放
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于将 HLOS 地址映射到列表时，由于核心中的双重释放导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | 315 5G IoT Modem | - |
II. Public POCs for CVE-2022-40507
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-06-06 · 32 CVEs total
| CVE-2022-33307 | 8.4 HIGH | Double free in Automotive |
| CVE-2023-21632 | 8.4 HIGH | Stack-based Buffer Overflow in Automotive GPU |
| CVE-2023-21628 | 8.4 HIGH | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN HAL |
| CVE-2022-40522 | 8.4 HIGH | Double free in Linux Networking |
| CVE-2023-21669 | 8.2 HIGH | Buffer Over-read in WLAN HOST |
| CVE-2022-33264 | 7.9 HIGH | Stack-based buffer overflow in Modem |
| CVE-2023-21670 | 7.8 HIGH | Improper Access control in GPU Subsystem |
| CVE-2023-21657 | 7.8 HIGH | Improper Input Validation in Audio |
| CVE-2023-21656 | 7.8 HIGH | Improper Input Validation in WLAN HOST |
| CVE-2022-22060 | 7.5 HIGH | Reachable Assertion in Modem |
| CVE-2022-33251 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-40521 | 7.5 HIGH | Improper authorization in Modem |
| CVE-2023-21659 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2023-21661 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2023-21660 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2023-21658 | 7.5 HIGH | Buffer Over-Read in WLAN Firmware |
| CVE-2022-40538 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-40536 | 7.5 HIGH | Improper authentication in Modem |
| CVE-2022-40523 | 7.1 HIGH | Information exposure in Kernel |
| CVE-2022-40525 | 7.1 HIGH | Information Exposure in Linux Networking Firmware |
Showing top 20 of 32 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-415
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V. Comments for CVE-2022-40507
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