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CVE-2022-22072

CVSS 7.8 · High EPSS 0.03% · P10
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I. Basic Information for CVE-2022-22072

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Buffer overflow can occur due to improper validation of NDP application information length in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于NDP 应用程序信息长度验证不当，攻击者利用该漏洞可能会发生缓冲区溢出。以下产品及版本受到影响：APQ8009, APQ8017, APQ8053, APQ8096AU, AR8031, CSRA6620, CSRA6640, MDM9150, MDM9206, MDM9250, MDM9607,
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music APQ8009, APQ8017, APQ8053, APQ8096AU, AR8031, CSRA6620, CSRA6640, MDM9150, MDM9206, MDM9250, MDM9607, MDM9626, MDM9628, MDM9650, MSM8937, PM8937, QCA4020, QCA6174A, QCA6175A, QCA6310, QCA6320, QCA6335, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QC -

II. Public POCs for CVE-2022-22072

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III. Intelligence Information for CVE-2022-22072

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Same Patch Batch · Qualcomm, Inc. · 2022-06-14 · 68 CVEs total

CVE-2022-256519.8 CRITICALQualcomm 芯片输入验证错误漏洞
CVE-2021-350819.8 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303419.8 CRITICAL多款Qualcomm产品缓冲区错误漏洞
CVE-2021-351049.8 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-350909.3 CRITICALQualcomm 安全漏洞
CVE-2021-350829.1 CRITICALQualcomm多款产品 安全漏洞
CVE-2021-303429.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303439.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303479.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303399.0 CRITICAL多款Qualcomm芯片安全漏洞
CVE-2021-351238.8 HIGH多款Qualcomm产品安全漏洞
CVE-2021-302818.4 HIGH多款Qualcomm产品访问控制错误漏洞
CVE-2021-303348.4 HIGH多款Qualcomm产品资源管理错误漏洞
CVE-2022-220718.4 HIGHQualcomm多款产品 资源管理错误漏洞
CVE-2022-220688.4 HIGH多款Qualcomm产品资源管理错误漏洞
CVE-2021-303508.4 HIGH多款Qualcomm 芯片缓冲区错误漏洞
CVE-2021-351128.4 HIGH多款Qualcomm产品访问控制错误漏洞
CVE-2021-351148.4 HIGHQualcomm 缓冲区错误漏洞
CVE-2021-351268.4 HIGH多款Qualcomm产品输入验证错误漏洞
CVE-2021-350958.4 HIGHQualcomm 芯片 代码问题漏洞

Showing top 20 of 68 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2022-22072

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