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CVE-2018-11847

EPSS 0.03% · P10
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I. Basic Information for CVE-2018-11847

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品Content Protection 输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm IPQ8074等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。Content Protection是其中的一个内容保护组件。 多款Qualcomm产品中的Content Protection存在输入验证漏洞。远程攻击者可利用该漏洞造成内核内存映射到EL0。以下产品受到影响：Qualcomm IPQ8074；MDM9206；MDM9607；MDM9650；MDM9655；MSM8909W；MSM8996AU；QCA8081；SD 210；SD 212；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon W IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439, Snap -

II. Public POCs for CVE-2018-11847

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III. Intelligence Information for CVE-2018-11847

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Same Patch Batch · Qualcomm, Inc. · 2019-02-11 · 12 CVEs total

CVE-2018-11855多款Qualcomm Snapdragon产品缓冲区错误漏洞
CVE-2018-11888多款Qualcomm产品Cyrpto Services 权限许可和访问控制问题漏洞
CVE-2018-11899多款Qualcomm产品输入验证错误漏洞
CVE-2018-11962Android Qualcomm Audio组件资源管理错误漏洞
CVE-2018-12006Android 信息泄露漏洞
CVE-2018-12010Android 缓冲区错误漏洞
CVE-2018-12011Android 信息泄露漏洞
CVE-2018-12014Android Qualcomm Data HLOS - LNX组件资源管理错误漏洞
CVE-2018-13888多款Qualcomm产品RIL 缓冲区错误漏洞
CVE-2018-13889Android Qualcomm GPS组件资源管理错误漏洞
CVE-2018-13893Android 缓冲区错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-11847

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