Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1000 CNY

100.0%
Buy Us a Coffee

CVE-2018-13888

EPSS 0.04% · P12
Get alerts for future matching vulnerabilitiesLog in to subscribe

I. Basic Information for CVE-2018-13888

Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品RIL 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm产品中的RIL存在缓冲区溢出漏洞。远程攻击者可利用该漏洞造成RIL守护进程中的内存损坏。以下产品受到影响：Qualcomm MDM9206；MDM9607；MDM9635M；MDM9650；MSM8909W；SD 210；SD 212；SD 205；SD 425；SD 427；SD 430；SD 435；SD 439；SD 429；SD 450；SD 625；SD 636；
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ -

II. Public POCs for CVE-2018-13888

#POC DescriptionSource LinkShenlong Link
AI-Generated POCPremium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2018-13888

Please Login to view more intelligence information

Same Patch Batch · Qualcomm, Inc. · 2019-02-11 · 12 CVEs total

CVE-2018-11847多款Qualcomm产品Content Protection 输入验证错误漏洞
CVE-2018-11855多款Qualcomm Snapdragon产品缓冲区错误漏洞
CVE-2018-11888多款Qualcomm产品Cyrpto Services 权限许可和访问控制问题漏洞
CVE-2018-11899多款Qualcomm产品输入验证错误漏洞
CVE-2018-11962Android Qualcomm Audio组件资源管理错误漏洞
CVE-2018-12006Android 信息泄露漏洞
CVE-2018-12010Android 缓冲区错误漏洞
CVE-2018-12011Android 信息泄露漏洞
CVE-2018-12014Android Qualcomm Data HLOS - LNX组件资源管理错误漏洞
CVE-2018-13889Android Qualcomm GPS组件资源管理错误漏洞
CVE-2018-13893Android 缓冲区错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-13888

No comments yet

Leave a comment