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CVE-2026-21366— Integer Overflow or Wraparound in Data Network Stack & Connectivity

CVSS 7.8 · High EPSS 0.07% · P0

Affected Version Matrix 33

VendorProductVersion RangeStatus
Qualcomm, Inc.SnapdragonLeMans_AU_LGITaffected
LeMansAUaffected
QAM8255Paffected
QAM8295Paffected
QAM8620Paffected
QAMSRV1Haffected
QAMSRV1Maffected
QCA6574AUaffected
… +25 more rows
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I. Basic Information for CVE-2026-21366

Vulnerability Information
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Vulnerability Title
Integer Overflow or Wraparound in Data Network Stack & Connectivity
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption while processing a packet with a size close to the maximum allowed value.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
整数溢出或超界折返
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国Qualcomm公司的一系列网络通信芯片组。 Qualcomm Chipsets存在数字错误漏洞，该漏洞源于处理大小接近最大允许值的数据包时发生内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon LeMans_AU_LGIT -

II. Public POCs for CVE-2026-21366

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III. Intelligence Information for CVE-2026-21366

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Vendor Advisories for CVE-2026-21366 (1)

Same Patch Batch · Qualcomm, Inc. · 2026-08-04 · 11 CVEs total

CVE-2026-252899.6 CRITICALStack-based Buffer Overflow in WLAN Firmware
CVE-2026-240798.1 HIGHMissing Authentication for Critical Function in Data Modem
CVE-2026-240837.8 HIGHUntrusted Pointer Dereference in Automotive Security
CVE-2026-240807.8 HIGHBuffer Copy Without Checking Size of Input in Biometrics
CVE-2026-252927.6 HIGHImproper Validation of Syntactic Correctness of Input in Automotive Linux OS
CVE-2026-240847.5 HIGHInsecure Security Identifier Mechanism in Multi-Mode Call Processor
CVE-2026-252887.4 HIGHBuffer Over-read in WLAN Firmware
CVE-2026-240766.7 MEDIUMBuffer Copy Without Checking Size of Input in Bluetooth HOST
CVE-2026-240786.5 MEDIUMExposure of Private Personal Information to an Unauthorized Actor in Data Modem
CVE-2026-240776.5 MEDIUMInteger Underflow (Wrap or Wraparound) in WLAN Host

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-190

V. Comments for CVE-2026-21366

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