CVE-2025-47371— Reachable Assertion in Modem
Get alerts for future matching vulnerabilitiesLog in to subscribe
I. Basic Information for CVE-2025-47371
Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗ Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.
Vulnerability Title
Reachable Assertion in Modem
Source: NVD (National Vulnerability Database)
Vulnerability Description
Transient DOS when an LTE RLC packet with invalid TB is received by UE.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
可达断言
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于接收无效TB的LTE RLC数据包，可能导致瞬时拒绝服务。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | 5G Fixed Wireless Access Platform | - |
II. Public POCs for CVE-2025-47371
| # | POC Description | Source Link | Shenlong Link |
|---|
AI-Generated POCPremium
No public POC found.
Login to generate AI POCIII. Intelligence Information for CVE-2025-47371
请登录查看更多情报信息。
Same Patch Batch · Qualcomm, Inc. · 2026-03-02 · 15 CVEs total
| CVE-2026-21385 | 7.8 HIGH | Integer Overflow or Wraparound in Graphics |
| CVE-2025-59603 | 7.8 HIGH | Out-of-bounds Write in Computer Vision |
| CVE-2025-59600 | 7.8 HIGH | Buffer Over-read in Graphics |
| CVE-2025-47386 | 7.8 HIGH | Use After Free in Automotive Audio |
| CVE-2025-47385 | 7.8 HIGH | Improper Access Control for Register Interface in SCE-Mink |
| CVE-2025-47381 | 7.8 HIGH | Use After Free in Automotive Audio |
| CVE-2025-47379 | 7.8 HIGH | Use After Free in Automotive Audio |
| CVE-2025-47377 | 7.8 HIGH | Use After Free in Automotive Audio |
| CVE-2025-47376 | 7.8 HIGH | Use After Free in Automotive Audio |
| CVE-2025-47375 | 7.8 HIGH | Use After Free in Automotive Audio |
| CVE-2025-47373 | 7.8 HIGH | Out-of-bounds Write in Automotive |
| CVE-2025-47383 | 7.2 HIGH | Missing Cryptographic Step in Data Modem |
| CVE-2025-47378 | 7.1 HIGH | Exposure of Sensitive System Information to an Unauthorized Control Sphere in HLOS |
| CVE-2025-47384 | 6.5 MEDIUM | Reachable Assertion in FW |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-617
- CVE-2026-8257
WebAssembly Binaryen BrOn wasm-ir-builder.cpp makeBrOn asser - CVE-2026-41584
ZEBRA: rk Identity Point Panic in Transaction Verification - CVE-2026-20450
MediaTek Chipsets 安全漏洞 - CVE-2026-41485
Kyverno Controller Denial of Service via forEach Mutation Pa - CVE-2026-34067
nimiq-transaction vulnerable to panic via `HistoryTreeProof`
V. Comments for CVE-2025-47371
No comments yet