CVE-2025-47321— Buffer Copy Without Checking Size of Input in Core Services
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I. Basic Information for CVE-2025-47321
Vulnerability Information
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Vulnerability Title
Buffer Copy Without Checking Size of Input in Core Services
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption while copying packets received from unix clients.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
未进行输入大小检查的缓冲区拷贝(传统缓冲区溢出)
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于复制来自unix客户端的数据包时内存损坏，可能导致拒绝服务。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | AR8031 | - |
II. Public POCs for CVE-2025-47321
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2025-12-18 · 11 CVEs total
| CVE-2025-47372 | 9.0 CRITICAL | Buffer Copy Without Checking Size of Input in Boot |
| CVE-2025-47387 | 7.8 HIGH | Untrusted Pointer Dereference in Camera |
| CVE-2025-47382 | 7.8 HIGH | Incorrect Authorization in Boot |
| CVE-2025-47350 | 7.8 HIGH | Use After Free in DSP Service |
| CVE-2025-47323 | 7.8 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2025-47322 | 7.8 HIGH | Use After Free in Automotive Linux OS |
| CVE-2025-47320 | 7.8 HIGH | Out-of-bounds Write in Audio |
| CVE-2025-27063 | 7.8 HIGH | Use After Free in Video |
| CVE-2025-47319 | 6.7 MEDIUM | Exposure of Sensitive System Information to an Unauthorized Control Sphere in HLOS |
| CVE-2025-47325 | 6.5 MEDIUM | Untrusted Pointer Dereference in TZ Firmware |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-120
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V. Comments for CVE-2025-47321
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