CVE-2023-33029— Use After Free in DSP Service
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I. Basic Information for CVE-2023-33029
Vulnerability Information
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Vulnerability Title
Use After Free in DSP Service
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in DSP Service during a remote call from HLOS to DSP.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
释放后使用
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在资源管理错误漏洞，该漏洞源于从 HLOS 到 DSP 的远程调用期间 DSP 服务中的内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | AR8035 | - |
II. Public POCs for CVE-2023-33029
| # | POC Description | Source Link | Shenlong Link |
|---|
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No public POC found.
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Same Patch Batch · Qualcomm, Inc. · 2023-10-03 · 22 CVEs total
| CVE-2023-33028 | 9.8 CRITICAL | Buffer Copy without Checking Size of Input in WLAN Firmware |
| CVE-2023-24855 | 9.8 CRITICAL | Use of Out-of-range Pointer Offset in Modem |
| CVE-2023-28540 | 9.1 CRITICAL | Improper Authentication in Data Modem |
| CVE-2023-21673 | 8.7 HIGH | Improper Access Control in Kernel |
| CVE-2023-24853 | 8.4 HIGH | Improper Input Validation in HLOS |
| CVE-2023-24844 | 8.4 HIGH | Improper Access Control in Core |
| CVE-2023-33039 | 8.4 HIGH | Use After Free in Automotive Display |
| CVE-2023-24849 | 8.2 HIGH | Buffer Over-read in Data Modem |
| CVE-2023-24848 | 8.2 HIGH | Buffer Over-read in Data Modem |
| CVE-2023-22385 | 8.2 HIGH | Buffer Over-read in Data Modem |
| CVE-2023-24850 | 7.8 HIGH | Improper Validation of Array Index in HLOS |
| CVE-2023-33034 | 7.8 HIGH | Signed-to-unsigned conversion error in Audio |
| CVE-2023-33035 | 7.8 HIGH | Buffer Copy Without Checking Size of Input in Audio |
| CVE-2023-33026 | 7.5 HIGH | Buffer over-read in WLAN Firmware |
| CVE-2023-33027 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2023-24847 | 7.5 HIGH | NULL pointer Dereference in Modem |
| CVE-2023-24843 | 7.5 HIGH | Reachable Assertion in Modem |
| CVE-2023-22382 | 7.4 HIGH | Improper Input Validation in Automotive |
| CVE-2023-22384 | 6.7 MEDIUM | Buffer Copy Without Checking Size of Input in VR Service |
| CVE-2023-28539 | 6.6 MEDIUM | Buffer Copy Without Checking Size of Input in WLAN Host |
Showing top 20 of 22 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2023-33029
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