CVE-2023-21624— Information Exposure in DSP Services
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I. Basic Information for CVE-2023-21624
Vulnerability Information
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Vulnerability Title
Information Exposure in DSP Services
Source: NVD (National Vulnerability Database)
Vulnerability Description
Information disclosure in DSP Services while loading dynamic module.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Source: NVD (National Vulnerability Database)
Vulnerability Type
信息暴露
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于加载动态模块时DSP服务中信息泄露。以下产品和版本受到影响：FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8255P, QCA6310, QCA6320, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6700 | - |
II. Public POCs for CVE-2023-21624
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-07-04 · 18 CVEs total
| CVE-2023-22667 | 8.4 HIGH | Integer Overflow or Wraparound in Audio |
| CVE-2023-21672 | 8.4 HIGH | Use After Free in Audio |
| CVE-2023-28541 | 7.8 HIGH | Buffer Over-read in WLAN Host |
| CVE-2023-24854 | 7.8 HIGH | Stack-based Buffer Overflow in WLAN HOST |
| CVE-2023-24851 | 7.8 HIGH | Buffer Copy Without Checking Size of Input in WLAN HOST |
| CVE-2023-22387 | 7.8 HIGH | Use of Out-of-range Pointer Offset in Qualcomm IPC |
| CVE-2023-22386 | 7.8 HIGH | Buffer Copy Without Checking Size of Input in WLAN HOST |
| CVE-2023-28542 | 7.8 HIGH | Buffer Over-read in WLAN HOST |
| CVE-2023-21631 | 7.5 HIGH | Improper Input Validation in Modem |
| CVE-2023-21629 | 6.8 MEDIUM | Double Free in Modem |
| CVE-2023-21639 | 6.7 MEDIUM | Buffer Copy Without Checking the Size of Input in Audio |
| CVE-2023-21638 | 6.7 MEDIUM | Incorrect Type Conversion or Cast in Video |
| CVE-2023-21637 | 6.7 MEDIUM | Improper Restrictions of Operations within the Bounds of a Memory Buffer in Linux |
| CVE-2023-21635 | 6.7 MEDIUM | Buffer Copy without Checking Size of Input in Data Network Stack & Connectivity |
| CVE-2023-21633 | 6.7 MEDIUM | Improper Restriction of Operations within the Bounds of a Memory Buffer in Linux |
| CVE-2023-21640 | 6.7 MEDIUM | Buffer Copy Without Checking Size of Input in Linux |
| CVE-2023-21641 | 6.6 MEDIUM | Permissions, Privileges, and Access Controls in Display |
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-200
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V. Comments for CVE-2023-21624
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