CVE-2022-33257— Time-of-check time-of-use race condition in Core
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I. Basic Information for CVE-2022-33257
Vulnerability Information
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Vulnerability Title
Time-of-check time-of-use race condition in Core
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
检查时间与使用时间(TOCTOU)的竞争条件
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | AQT1000 | - |
II. Public POCs for CVE-2022-33257
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2023-03-07 · 25 CVEs total
| CVE-2022-33256 | 9.8 CRITICAL | Improper validation of array index in Multi-mode call processor |
| CVE-2022-40539 | 8.4 HIGH | Improper Validation of Array Index in Automotive Android OS |
| CVE-2022-25655 | 8.4 HIGH | Buffer copy without checking the size of input in WLAN HAL. |
| CVE-2022-25694 | 8.4 HIGH | Use of Out-of-range Pointer Offset in MODEM |
| CVE-2022-25709 | 8.4 HIGH | Use of Out-of-range Pointer Offset in Data Modem |
| CVE-2022-40530 | 8.4 HIGH | Integer overflow to buffer overflow in WLAN |
| CVE-2022-40540 | 8.4 HIGH | Buffer copy without checking the size of input in Linux Kernel |
| CVE-2022-40531 | 8.4 HIGH | Incorrect type conversion in WLAN |
| CVE-2022-25705 | 7.8 HIGH | Integer Overflow to Buffer Overflow in Modem |
| CVE-2022-33278 | 7.8 HIGH | Buffer copy without checking the size of input in HLOS |
| CVE-2022-33242 | 7.8 HIGH | Improper authentication in Qualcomm IPC |
| CVE-2022-40527 | 7.5 HIGH | Reachable Assertion in WLAN Embedded SW |
| CVE-2022-40535 | 7.5 HIGH | Buffer Over-read in WLAN |
| CVE-2022-33213 | 7.5 HIGH | Memory Corruption in MODEM |
| CVE-2022-33244 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-33250 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-33254 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-33272 | 7.5 HIGH | Reachable assertion in Modem |
| CVE-2022-33309 | 7.5 HIGH | Buiffer over-read in WLAN Firmware. |
| CVE-2022-40537 | 7.3 HIGH | Improper Validation of Array Index in Bluetooth HOST |
Showing top 20 of 25 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-367
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V. Comments for CVE-2022-33257
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