CVE-2022-25716— Time-of-check Time-of-use Race Condition in Multimedia Framework
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I. Basic Information for CVE-2022-25716
Vulnerability Information
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Vulnerability Title
Time-of-check Time-of-use Race Condition in Multimedia Framework
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in Multimedia Framework due to unsafe access to the data members
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款 Qualcomm 芯片存在安全漏洞，该漏洞源于对数据成员的不安全访问，导致多媒体框架中的内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | SD888 5G | - |
II. Public POCs for CVE-2022-25716
| # | POC Description | Source Link | Shenlong Link |
|---|
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No public POC found.
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Same Patch Batch · Qualcomm, Inc. · 2023-01-06 · 30 CVEs total
| CVE-2022-22088 | 9.8 CRITICAL | Integer Overflow to Buffer Overflow in Bluetooth HOST |
| CVE-2022-33219 | 9.3 CRITICAL | Integer Overflow to Buffer Overflow in Automotive |
| CVE-2022-40520 | 8.4 HIGH | Stack based buffer overflow in Core |
| CVE-2022-40517 | 8.4 HIGH | Stack based buffer overflow in Core |
| CVE-2022-40516 | 8.4 HIGH | Stack-based buffer overflow in Core |
| CVE-2022-33300 | 8.4 HIGH | Improper input validation in Automotive Android OS |
| CVE-2022-33276 | 8.4 HIGH | Buffer copy without checking size of input in Modem |
| CVE-2022-33274 | 8.4 HIGH | Improper validation of array index in Android Core |
| CVE-2022-33218 | 8.2 HIGH | Improper Input Validation in Automotive |
| CVE-2022-33252 | 8.2 HIGH | Buffer over-read in WLAN |
| CVE-2022-33284 | 8.2 HIGH | Buffer over-read in WLAN |
| CVE-2022-33255 | 8.2 HIGH | Buffer over-read in Bluetooth HOST |
| CVE-2022-33283 | 8.2 HIGH | Buffer over-read in WLAN |
| CVE-2022-25746 | 8.1 HIGH | Buffer Copy Without Checking Size of Input in Kernel |
| CVE-2022-33253 | 7.5 HIGH | Buffer over-read in WLAN |
| CVE-2022-33285 | 7.5 HIGH | Buffer over-read in WLAN |
| CVE-2022-33286 | 7.5 HIGH | Buffer over-read in WLAN |
| CVE-2022-33290 | 7.5 HIGH | Null pointer dereference in Bluetooth HOST |
| CVE-2022-33299 | 7.5 HIGH | Null pointer dereference in Bluetooth HOST |
| CVE-2022-33265 | 7.3 HIGH | Information exposure in Powerline Communication Firmware |
Showing top 20 of 30 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-25716
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