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CVE-2021-35132

CVSS 8.4 · High EPSS 0.10% · P27
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I. Basic Information for CVE-2021-35132

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于DSP服务中的边界错误而导致的。 恶意应用程序可以触发缓冲区溢出并以提升的权限执行任意代码。 该漏洞允许本地应用程序提升系统上的权限。以下产品及版本受到影响：AQT1000, AR8035, QCA6390, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QC
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables AQT1000, AR8035, QCA6390, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCM2290, QCM4290, QCM6490, QCS2290, QCS410, QCS4290, QCS610, QCS6490, QRB5165, QRB5165M, QRB5165N, -

II. Public POCs for CVE-2021-35132

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III. Intelligence Information for CVE-2021-35132

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Same Patch Batch · Qualcomm, Inc. · 2022-09-02 · 30 CVEs total

CVE-2022-220969.8 CRITICALQualcomm 芯片缓冲区错误漏洞
CVE-2021-351229.3 CRITICALQualcomm 芯片输入验证错误漏洞
CVE-2022-256808.4 HIGHQualcomm Multimedia 安全漏洞
CVE-2021-351348.4 HIGHQualcomm 芯片安全漏洞
CVE-2022-220598.4 HIGHGoogle Pixel 缓冲区错误漏洞
CVE-2022-220808.4 HIGHGoogle Pixel 缓冲区错误漏洞
CVE-2022-220978.4 HIGHQualcomm 芯片资源管理错误漏洞
CVE-2022-220988.4 HIGHQualcomm 芯片缓冲区错误漏洞
CVE-2022-220998.4 HIGHQualcomm Multimedia 输入验证错误漏洞
CVE-2022-221048.4 HIGHQualcomm 芯片缓冲区错误漏洞
CVE-2022-221028.4 HIGHQualcomm 芯片代码问题漏洞
CVE-2022-221068.4 HIGHQualcomm Multimedia 安全漏洞
CVE-2022-221008.4 HIGHQualcomm 芯片缓冲区错误漏洞
CVE-2022-220628.2 HIGHGoogle Pixel 缓冲区错误漏洞
CVE-2022-220707.8 HIGHGoogle Pixel 缓冲区错误漏洞
CVE-2022-220617.8 HIGHGoogle Pixel 安全漏洞
CVE-2022-220697.7 HIGHGoogle Pixel 安全漏洞
CVE-2022-220677.5 HIGHGoogle Pixel 安全漏洞
CVE-2022-256587.3 HIGHQualcomm 芯片缓冲区错误漏洞
CVE-2021-350977.3 HIGHQualcomm 芯片数据伪造问题漏洞

Showing top 20 of 30 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-35132

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