CVE-2021-30274
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I. Basic Information for CVE-2021-30274
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible integer overflow in access control initialization interface due to lack and size and address validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款 Qualcomm 产品中存在输入验证错误漏洞，该漏洞源于产品的访问初始化接口缺乏对整数进行大小验证。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | AR8031, AR8035, CSR8811, CSRA6620, CSRA6640, CSRB31024, FSM10055, FSM10056, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028, MDM9150, MDM9205, QCA4004, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, Q | - |
II. Public POCs for CVE-2021-30274
| # | POC Description | Source Link | Shenlong Link |
|---|
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No public POC found.
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Same Patch Batch · Qualcomm, Inc. · 2022-01-03 · 28 CVEs total
| CVE-2021-30351 | 9.8 CRITICAL | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-30275 | 9.3 CRITICAL | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-30276 | 9.3 CRITICAL | Qualcomm 芯片安全漏洞 |
| CVE-2021-30262 | 8.4 HIGH | Qualcomm Chipsets 资源管理错误漏洞 |
| CVE-2021-30335 | 8.4 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30336 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30282 | 8.4 HIGH | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2021-30337 | 8.4 HIGH | Qualcomm 芯片资源管理错误漏洞 |
| CVE-2021-30303 | 7.8 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30267 | 7.8 HIGH | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-30268 | 7.8 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30289 | 7.8 HIGH | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2021-30279 | 7.8 HIGH | Qualcomm SDX55和QCA6390 访问控制错误漏洞 |
| CVE-2021-30273 | 7.5 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30293 | 7.5 HIGH | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-30272 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30271 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30270 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30269 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2020-11263 | 7.3 HIGH | Qualcomm SDX55和QCA6390 输入验证错误漏洞 |
Showing top 20 of 28 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30274
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