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CVE-2020-11167

EPSS 0.33% · P56
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I. Basic Information for CVE-2020-11167

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption while calculating L2CAP packet length in reassembly logic when remote sends more data than expected in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款Qualcomm产品存在输入验证错误漏洞，该漏洞源于当远程发送的数据超出预期时，在重组逻辑中计算L2CAP数据包长度时出现内存损坏。以下产品和版本受到影响：Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdrag
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009W, APQ8017, APQ8037, APQ8053, APQ8064AU, APQ8096AU, AQT1000, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, PM215, PM3003A, PM439, PM6125, PM6150, PM6150A, PM6150L, PM6350, PM640A, PM640L, PM640P, PM660, PM660L, PM670, PM670A, PM -

II. Public POCs for CVE-2020-11167

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III. Intelligence Information for CVE-2020-11167

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Same Patch Batch · Qualcomm, Inc. · 2021-01-21 · 34 CVEs total

CVE-2020-11215多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11181多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11183多款Qualcomm产品安全漏洞
CVE-2020-11185多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11197多款Qualcomm产品输入验证错误漏洞
CVE-2020-11200多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11212多款Qualcomm产品 缓冲区错误漏洞
CVE-2020-11213多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11214多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11180多款 Qualcomm 产品输入验证错误漏洞
CVE-2020-11216多款Qualcomm产品输入验证错误漏洞
CVE-2020-11217多款Qualcomm产品资源管理错误漏洞
CVE-2020-11225多款Qualcomm产品安全漏洞
CVE-2020-3685多款Qualcomm产品资源管理错误漏洞
CVE-2020-3686多款Qualcomm产品安全漏洞
CVE-2020-3687Qualcomm Bluetooth Host 信息泄露漏洞
CVE-2020-3691多款Qualcomm产品数字错误漏洞
CVE-2020-11119多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11179Qualcomm Adreno GPU缓冲区错误漏洞
CVE-2020-11152多款Qualcomm产品竞争条件问题漏洞

Showing top 20 of 34 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2020-11167

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