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CVE-2019-2345

EPSS 0.03% · P10
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I. Basic Information for CVE-2019-2345

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Race condition while accessing DMA buffer in jpeg driver in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM660, SDX20, SDX24
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品Camera库竞争条件问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MSM8996AU等都是美国高通（Qualcomm）公司的产品。MSM8996AU是一款中央处理器（CPU）产品。SD 712是一款中央处理器（CPU）产品。SDX24是一款调制解调器。 多款Qualcomm产品中的Camera库存在竞争条件问题漏洞。该漏洞源于网络系统或产品在运行过程中，并发代码需要互斥地访问共享资源时，对于并发访问的处理不当。以下产品及版本受到影响：Qualcomm MSM8909W；MSM8996AU；QCS605；SD 425；SD 427；SD 430；SD 4
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM660, SDX20, SDX24 -

II. Public POCs for CVE-2019-2345

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III. Intelligence Information for CVE-2019-2345

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Same Patch Batch · Qualcomm, Inc. · 2019-07-25 · 38 CVEs total

CVE-2019-2239多款Qualcomm产品输入验证错误漏洞
CVE-2019-2327多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2328多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2330多款Qualcomm产品输入验证错误漏洞
CVE-2019-2334多款Qualcomm产品代码问题漏洞
CVE-2018-13897多款Qualcomm产品信息泄露漏洞
CVE-2019-2235多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2236多款Qualcomm产品代码问题漏洞
CVE-2019-2237多款Qualcomm产品代码问题漏洞
CVE-2019-2238多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2326多款Qualcomm产品输入验证错误漏洞
CVE-2019-2240多款Qualcomm产品代码问题漏洞
CVE-2019-2241多款Qualcomm产品输入验证错误漏洞
CVE-2019-2253多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2254多款Qualcomm产品信息泄露漏洞
CVE-2019-2263多款Qualcomm产品资源管理错误漏洞
CVE-2019-2272多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2273多款Qualcomm产品Video Driver 缓冲区错误漏洞
CVE-2019-2276多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2305多款Qualcomm产品WLAN 缓冲区错误漏洞

Showing top 20 of 38 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2019-2345

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