Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1000 CNY

100.0%

CVE-2019-14075

EPSS 0.04% · P12
Get alerts for future matching vulnerabilitiesLog in to subscribe

I. Basic Information for CVE-2019-14075

Vulnerability Information

Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Null pointer dereference issue in radio interface layer due to lack of null check in sapmodule destructor in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9607, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8998, Nicobar, QCS605, Rennell, Saipan, SDM450, SDM630, SDM636, SDM660, SDM670, SDM710, SM6150, SM7150, SM8150, SM8250, SXR2130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通(Qualcomm)公司的一款中央处理器(CPU)产品。 多款Qualcomm产品中的Radio Interface layer存在代码问题漏洞。该漏洞源于网络系统或产品的代码开发过程中存在设计或实现不当的问题。以下产品及版本受到影响:Qualcomm MDM9607;MSM8917;MSM8920;MSM8937;MSM8940;MSM8953;MSM8998;Nicobar;QCS605;Rennell;Saipan;SDM450;SDM630;SDM63
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile MDM9607, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8998, Nicobar, QCS605, Rennell, Saipan, SDM450, SDM630, SDM636, SDM660, SDM670, SDM710, SM6150, SM7150, SM8150, SM8250, SXR2130 -

II. Public POCs for CVE-2019-14075

#POC DescriptionSource LinkShenlong Link
AI-Generated POCPremium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2019-14075

登录查看更多情报信息。

Same Patch Batch · Qualcomm, Inc. · 2020-04-16 · 48 CVEs total

CVE-2019-14111多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14114多款Qualcomm产品输入验证错误漏洞
CVE-2019-14122多款Qualcomm产品安全漏洞
CVE-2019-14134多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14135多款Qualcomm产品缓冲区错误漏洞
CVE-2020-3651多款Qualcomm产品安全漏洞
CVE-2020-3652多款Qualcomm产品缓冲区错误漏洞
CVE-2020-3653多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14132多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14112多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14113多款Qualcomm产品输入验证错误漏洞
CVE-2019-14110多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14105Qualcomm SDA845、SDM845和SM8150 缓冲区错误漏洞
CVE-2019-14104多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14070多款Qualcomm产品资源管理错误漏洞
CVE-2019-14033多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14022多款Qualcomm产品安全漏洞
CVE-2019-14021多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14020多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14019多款Qualcomm产品缓冲区错误漏洞

Showing top 20 of 48 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

V. Comments for CVE-2019-14075

No comments yet


Leave a comment