CVE-2018-13896
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I. Basic Information for CVE-2018-13896
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
XBL_SEC image authentication and other crypto related validations are accessible to a compromised OEM XBL Loader due to missing lock at XBL_SEC stage.. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品访问控制错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在访问控制错误漏洞。该漏洞源于网络系统或产品未正确限制来自未授权角色的资源访问。以下产品及版本受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MDM9655；MSM8996AU；QCS404；QCS605；Qualcomm 215；SD 410/12；SD 425；SD 427；SD 430；SD 435；SD 439；SD 429；SD 450；
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SD | - |
II. Public POCs for CVE-2018-13896
| # | POC Description | Source Link | Shenlong Link |
|---|
AI-Generated POCPremium
No public POC found.
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- https://www.qualcomm.com/company/product-security/bulletinsx_refsource_CONFIRM
- https://nvd.nist.gov/vuln/detail/CVE-2018-13896
Same Patch Batch · Qualcomm, Inc. · 2019-07-22 · 12 CVEs total
| CVE-2018-13924 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2018-13927 | 多款Qualcomm产品授权问题漏洞 | |
| CVE-2019-2243 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2260 | 多款Qualcomm产品资源管理错误漏洞 | |
| CVE-2019-2261 | 多款Qualcomm产品配置错误漏洞 | |
| CVE-2019-2264 | 多款Qualcomm产品代码问题漏洞 | |
| CVE-2019-2269 | 多款Qualcomm产品WLAN 缓冲区错误漏洞 | |
| CVE-2019-2277 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2279 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2287 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2292 | 多款Qualcomm产品缓冲区错误漏洞 |
IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2018-13896
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