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CVE-2018-13887

EPSS 0.33% · P56
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I. Basic Information for CVE-2018-13887

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Untrusted header fields in GNSS XTRA3 function can lead to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8909W, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, SM7150, SXR1130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品GNSS模块输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的产品。MDM9206是一款中央处理器（CPU）产品。MDM9607是一款中央处理器（CPU）产品。MDM9650是一款中央处理器（CPU）产品。GNSS module是其中的一个全球卫星导航系统模块。 多款Qualcomm产品中的GNSS模块存在输入验证错误漏洞。该漏洞源于网络系统或产品未对输入的数据进行正确的验证。以下产品及版本受到影响：Qualcomm MDM9150；MDM9206；MDM9607；MDM9635M；MDM965
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables MDM9150, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8909W, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 625, SD 632, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 835, SD 845 / SD 850 -

II. Public POCs for CVE-2018-13887

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III. Intelligence Information for CVE-2018-13887

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Same Patch Batch · Qualcomm, Inc. · 2019-05-24 · 31 CVEs total

CVE-2018-13920多款Qualcomm产品资源管理错误漏洞
CVE-2018-11923多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11271多款Qualcomm产品授权问题漏洞
CVE-2018-11924多款Qualcomm产品输入验证错误漏洞
CVE-2018-11925多款Qualcomm产品输入验证错误漏洞
CVE-2018-11927多款Qualcomm产品输入验证错误漏洞
CVE-2018-11928多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11930多款Qualcomm产品数字错误漏洞
CVE-2018-11936多款Qualcomm产品资源管理错误漏洞
CVE-2018-11937多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11940多款Qualcomm产品缓冲区错误漏洞
CVE-2019-2247多款Qualcomm产品资源管理错误漏洞
CVE-2019-2245多款Qualcomm产品数字错误漏洞
CVE-2019-2244多款Qualcomm产品数字错误漏洞
CVE-2018-13925多款Qualcomm产品资源管理错误漏洞
CVE-2019-2248多款Qualcomm产品缓冲区错误漏洞
CVE-2018-13899多款Qualcomm产品Video Driver 资源管理错误漏洞
CVE-2018-13895多款Qualcomm产品访问控制错误漏洞
CVE-2018-13886多款Qualcomm产品输入验证错误漏洞
CVE-2018-13885多款Qualcomm产品信息泄露漏洞

Showing top 20 of 31 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-13887

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