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CVE-2018-11820

EPSS 0.05% · P16
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I. Basic Information for CVE-2018-11820

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Use of non-time constant memcmp function creates side channel that leaks information and leads to cryptographic issues in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 800, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品加密问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在加密问题漏洞，该漏洞源于网络系统或产品未正确使用相关密码算法，导致内容未正确加密、弱加密、明文存储敏感信息等。以下产品受到影响：Qualcomm IPQ8074；MDM9150；MDM9206；MDM9607；MDM9640；MDM9650；MDM9655；MSM8996AU；QCA8081；QCS605；SD 210；SD 212；SD 205；SD 410/12；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure an IPQ8074, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD -

II. Public POCs for CVE-2018-11820

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III. Intelligence Information for CVE-2018-11820

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Same Patch Batch · Qualcomm, Inc. · 2019-02-25 · 17 CVEs total

CVE-2018-11289多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11845多款Qualcomm产品信息泄露漏洞
CVE-2018-11864多款Qualcomm产品输入验证漏洞
CVE-2018-11931多款Qualcomm产品输入验证漏洞
CVE-2018-11932多款Qualcomm产品输入验证漏洞
CVE-2018-11935多款Qualcomm产品输入验证漏洞
CVE-2018-11938多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11945多款Qualcomm产品缓冲区错误漏洞
CVE-2018-11948多款Qualcomm产品安全漏洞
CVE-2018-13900多款Qualcomm产品安全漏洞
CVE-2018-13904多款Qualcomm产品输入验证漏洞
CVE-2018-13905多款Qualcomm产品安全漏洞
CVE-2018-13912多款Qualcomm产品缓冲区错误漏洞
CVE-2018-13913多款Qualcomm产品输入验证错误漏洞
CVE-2018-13914多款Qualcomm产品缓冲区错误漏洞
CVE-2018-5839多款Qualcomm产品访问控制错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-11820

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