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CVE-2016-2063

EPSS 0.07% · P20
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I. Basic Information for CVE-2016-2063

Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Innovation Center Android contributions for MSM 基于栈的缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Innovation Center Android contributions for MSM是一款用于MSM项目支持用户建立基于Android平台并包含其他增强功能的高通芯片产品；MSM Thermal driver for the Linux kernel是一个用于Linux系统内核中的热驱动程序。 QuIC Android contributions for MSM设备和其他产品中使用的SM Thermal driver for the Linux kernel 3.x版本中dri
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

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II. Public POCs for CVE-2016-2063

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III. Intelligence Information for CVE-2016-2063

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Same Patch Batch · n/a · 2016-08-07 · 50 CVEs total

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Showing top 20 of 50 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

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